Researchers Create Eco-Friendly Heat-Dissipating Material Using Egg Whites

A research team led by Dr. Hyun-Ae Cha from the Korea Institute of Materials Science (KIMS) has developed a groundbreaking heat-dissipating composite material that combines eco-friendliness with cost-effective processing. Using an innovative protein foaming technique inspired by egg whites, the team created a three-dimensional magnesium oxide (MgO) structure that significantly enhances thermal conductivity, achieving levels up to 2.6 times higher than traditional materials.

As electronic devices continue to evolve, their heat generation increases, necessitating advanced thermal management solutions. This challenge is particularly critical for electric vehicles (EVs), where inadequate cooling can lead to performance issues, fires, or explosions. At the heart of effective thermal management systems is the Thermal Interface Material (TIM), which is essential for efficient heat dissipation. Conventional TIMs often rely on randomly dispersed thermally conductive fillers within a polymer matrix, but this method typically results in broken thermal pathways and limited performance.

To overcome these limitations, the team employed a protein foaming method to create a tightly interconnected particle structure. By utilizing the property of egg-white proteins that expand when heated, they successfully formed a three-dimensional network that allows for continuous thermal pathways. This innovative process resulted in a composite material with an impressive thermal conductivity of 17.19 W/m·K, demonstrating exceptional heat dissipation capabilities.

Another notable advantage of this new material is that it utilizes magnesium oxide, a lightweight and low-cost resource. The resulting composite outperformed widely used materials such as aluminum oxide (Al2O3) and nitride-based heat dissipation substances. Furthermore, by integrating the composite with epoxy resin, a polymer commonly used for thermal fillers, the team created a practical solution suitable for real-world applications.

This technology holds the potential to significantly improve the performance and stability of various devices that generate substantial heat, including electronic equipment, semiconductor packages, EV batteries, 5G communication devices, and high-performance servers. The domestic market for thermal interface materials in South Korea is estimated to exceed KRW 200 billion annually, yet it currently relies heavily on imports. The commercialization of this new technology is expected to enhance South Korea’s technological self-reliance in thermal management materials.

In her statement, Dr. Hyun-Ae Cha emphasized the environmental and economic benefits of this research: “Through the protein foaming-based process, we can produce high-thermal-conductivity materials in an eco-friendly and cost-effective way.” She highlighted that this study exemplifies the feasibility of developing lightweight, high-performance heat-dissipating materials.

The findings of this research were published on May 28, 2023, in the esteemed journal Advanced Science, where they were selected as the cover article for Volume 12, Issue 33. This research was funded by the Nano Materials Technology Development Program of the National Research Foundation of Korea (NRF).

KIMS, the institution behind this innovation, is a non-profit government-funded research institute under the Ministry of Science and ICT of the Republic of Korea. It specializes in materials technology and has played a crucial role in advancing the Korean industry through extensive research and development initiatives.